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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU4EV-L2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EV | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| 10AS048E3F29E2SG | Intel® FPGAs | 780-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| XCZU2CG-L2SBVA484E | Xilinx | IC FPGA 82 I/O 484FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | - | 484-FCBGA (19x19) | - | |
| 10AS032H4F35E3SG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| M2S090TS-FG484 | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S010S-TQG144I | Microsemi | IC FPGA SOC | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 10AS032E1F27E1HG | Intel® FPGAs | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| 5ASXBB5D4F31C5N | Intel® FPGAs | IC FPGA 170 I/O 896FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BBGA, FCBGA | 5ASXBB5 | 896-FBGA (31x31) | - | |
| M2S010-TQ144I | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - | |
| XCZU5EV-L2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EV | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.