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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS032E1F27I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 240 I/O 672FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
XCZU9EG-L1FFVC900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
A2F200M3F-PQ208 Microsemi IC FPGA 200K GATES 256KB 208QFP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 208-BFQFP A2F200 208-PQFP (28x28) -
A2F500M3G-PQG208 Microsemi IC FPGA 500K GATES 512KB 208QFP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 208-BFQFP A2F500M3G 208-PQFP (28x28) -
1SX250LN3F43E2VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S005-VF256 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
M2S010-FGG484 Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S010 484-FPBGA (23x23) -
M2S025TS-VFG400 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
10AS032E2F27E2LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
A2F500M3G-1FG256 Microsemi IC FPGA 500K GATES 512KB 256-BGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FPBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.