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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU5CG-L1SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
1SX250LH2F55I2VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
10AS057K3F35I2SG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S025-1FGG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S025 484-FPBGA (23x23) -
10AS066N1F40I1HG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
10AS027E3F29I2SG Intel® FPGAs 780-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XCZU9EG-1FFVB1156I Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XC7Z035-3FBG676E Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
XC7Z030-1FFG676C Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z030 676-FCBGA (27x27) -
XCZU7CG-1FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.