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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
1SX280LN2F43I2VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
M2S050T-1VF400 Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S050T 400-VFBGA (17x17) -
XCZU2EG-2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
10AS048H4F34I3SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XC7Z100-L2FFG900I Xilinx IC SOC CORTEX-A9 KINTEX7 900BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
5CSEBA5U23I7N Altera (Intel® Programmable Solutions Group) IC FPGA 145 I/O 672UBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 672-FBGA 5CSEBA5 672-UBGA (23x23) -
10AS016E4F27E3LG Intel® FPGAs IC SOC FPGA 240 I/O 672FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
XC7Z030-L2FBG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
M2S005S-1VFG256I Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
M2S010TS-FG484 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.