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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCM33838MKFEBG-B2P | Avago Technologies (Broadcom Limited) | MODEM DOCSIS 3.0 8X4 | - | - | - | - | - | - | - | - | - | |
| M2S025T-1VF256I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 256-VFBGA | - | 256-BGA (17x17) | - | |
| 10AS027E3F29E2LG | Intel® FPGAs | 780-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| XCZU19EG-L1FFVE1924I | Xilinx | IC FPGA 668 I/O 1924FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1924-BBGA, FCBGA | - | 1924-FCBGA (45x45) | - | |
| 5CSEMA2U23A7N | Intel® FPGAs | IC FPGA 188 I/O 672UBGA | Automotive, AEC-Q100, Cyclone® V SE | -40°C ~ 125°C (TJ) | - | Tray | - | 672-FBGA | - | 672-UBGA (23x23) | - | |
| M2S010-1FG484 | Microsemi | IC FPGA SOC 10K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S010 | 484-FPBGA (23x23) | - | |
| M2S060-FGG676 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - | |
| M2S090T-FGG484I | Microsemi | IC FPGA SOC 90K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S060T-1FG484 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| 10AS022E3F27E2SG | Intel® FPGAs | 672-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.