• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai

Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
Manufacturer
Series
Operating Temperature
Packaging
Package / Case
Base Part Number
Supplier Device Package

Clear Filters

Loading products…

Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU11EG-3FFVC1760E Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
10AS032H3F34I2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
M2S025T-1FCS325 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
5ASXMB5E4F31C4N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 896-BBGA, FCBGA 5ASXMB5 896-FBGA (31x31) -
XCZU11EG-L1FFVC1156I Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XCZU11EG-2FFVC1760I Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
1SX280LU2F50E2VG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XC7Z030-2FB484I Xilinx IC SOC CORTEX-A9 KINTEX7 484BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (23x23) -
A2F200M3F-1PQ208 Microsemi IC FPGA 200K GATES 256KB 208QFP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 208-BFQFP A2F200 208-PQFP (28x28) -
10AS057K1F40I1HG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.