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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-1FFG1156I | Xilinx | IC SOC CORTEX A-9 ZYNQ7 1156BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| 10AS066H1F34E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | |
| M2S060TS-FG676 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - | |
| 10AS066K4F35I3SGES | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 1SX280LN2F43I1VG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| M2S050T-VFG400 | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | M2S050T | 400-VFBGA (17x17) | - | |
| 5CSEBA5U23I7SN | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | - | Tray | - | 672-FBGA | 5CSEBA5 | 672-UBGA (23x23) | - | |
| A2F500M3G-CSG288 | Microsemi | IC FPGA 500K GATES 512KB 288-CSP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F500M3G | 288-CSP (11x11) | - | |
| 10AS048E4F29E3LG | Intel® FPGAs | 780-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 10AS016E3F29E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 288 I/O 780FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.