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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S010TS-1VFG256T2 Microsemi IC FPGA SOC Automotive, AEC-Q100, SmartFusion®2 -40°C ~ 125°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
M2S005-1TQ144 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
M2S010-1VFG256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
XCZU4EV-1FBVB900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU11EG-2FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S050-1FGG484 Microsemi IC FPGA SOC 50K LUTS 896FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S050 484-FPBGA (23x23) -
5CSEMA4U23I7N Intel® FPGAs IC FPGA 224 I/O 672UBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 672-FBGA 5CSEMA4 672-UBGA (23x23) -
XC7Z030-1FF676I Xilinx IC FPGA XC ZYNQ-7000 676FCBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
5CSXFC6C6U23C6N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSXFC6 672-UBGA (23x23) -
10AS066K4F35I3LG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.