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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S060TS-VF400I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
1SX250LH3F55I1VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XCZU19EG-3FFVC1760E Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
M2S060-FG676I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
5ASXBB3D4F31C4N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 896-BBGA, FCBGA 5ASXBB3 896-FBGA (31x31) -
XC7Z100-1FFG1156I Xilinx IC SOC CORTEX A-9 ZYNQ7 1156BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
10AS066H1F34E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S060TS-FG676 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
10AS066K4F35I3SGES Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
1SX280LN2F43I1VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.