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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S100-1FC1152I Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100 1152-FCBGA (35x35) -
BCM33843EUKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
A2F060M3E-1CS288 Microsemi IC FPGA 60K GATES 128KB 288-CSP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 288-TFBGA, CSPBGA A2F060M3E 288-CSP (11x11) -
M2S150-FCVG484 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BFBGA - 484-BGA -
10AS057K3F35E2LG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
10AS016E4F29I3LG Intel® FPGAs IC SOC FPGA 288 I/O 780FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
XCZU11EG-L1FFVB1517I Xilinx IC FPGA 488 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS066K2F35E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S005S-VF400I Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
A2F200M3F-1CS288 Microsemi IC FPGA 200K GATES 256KB 288-CSP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 288-TFBGA, CSPBGA A2F200 288-CSP (11x11) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.