Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z020-1CLG484I | Xilinx | IC SOC CORTEX-A9 ARTIX-7 484BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-LFBGA, CSPBGA | XC7Z020 | 484-CSPBGA (19x19) | - | |
| M2S090T-1FG484I | Microsemi | IC FPGA SOC 90K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | M2S090T | 484-FPBGA (23x23) | - | |
| 10AS057K2F40I1HG | Intel® FPGAs | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - | |
| 5ASXFB3H4F40C4N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXFB3 | 1517-FBGA (40x40) | - | |
| 5ASTFD5G3F35I3N | Intel® FPGAs | IC FPGA 350 I/O 1152FBGA | Arria V ST | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | 5ASTFD5 | 1152-FBGA (35x35) | - | |
| XC7Z030-1SBG485C | Xilinx | IC SOC CORTEX A-9 ZYNQ7 485BGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-FBGA | - | 485-FBGA (19x19) | - | |
| M2S060T-FGG484I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| 5ASTMD5E3F31I3N | Intel® FPGAs | IC FPGA 170 I/O 896FBGA | Arria V ST | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BBGA, FCBGA | 5ASTMD5 | 896-FBGA (31x31) | - | |
| XC7Z045-2FFG676I | Xilinx | IC SOC CORTEX-A9 KINTEX7 676FBGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | XC7Z045 | 676-FCBGA (27x27) | - | |
| XCZU19EG-L2FFVD1760E | Xilinx | IC FPGA 308 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.