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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XC7Z020-1CLG484I Xilinx IC SOC CORTEX-A9 ARTIX-7 484BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA XC7Z020 484-CSPBGA (19x19) -
M2S090T-1FG484I Microsemi IC FPGA SOC 90K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S090T 484-FPBGA (23x23) -
10AS057K2F40I1HG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
5ASXFB3H4F40C4N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXFB3 1517-FBGA (40x40) -
5ASTFD5G3F35I3N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V ST -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASTFD5 1152-FBGA (35x35) -
XC7Z030-1SBG485C Xilinx IC SOC CORTEX A-9 ZYNQ7 485BGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 484-FBGA - 485-FBGA (19x19) -
M2S060T-FGG484I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
5ASTMD5E3F31I3N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V ST -40°C ~ 100°C (TJ) - Tray - 896-BBGA, FCBGA 5ASTMD5 896-FBGA (31x31) -
XC7Z045-2FFG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -
XCZU19EG-L2FFVD1760E Xilinx IC FPGA 308 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.