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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5ASXFB5G4F35I5N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXFB5 1152-FBGA (35x35) -
5ASTFD5K3F40I5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V ST -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASTFD5 1517-FBGA (40x40) -
A2F500M3G-1FGG256 Microsemi IC FPGA 512K FLASH 256FBGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FBGA (17x17) -
1SX280LU2F50E1VG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS057K4F40I3SG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU11EG-3FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S050-FG484I Microsemi IC FPGA SOC 50K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
10AS016C4U19I3SG Intel® FPGAs IC SOC FPGA 192 I/O 484UBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 484-BFBGA, FCBGA - 484-UBGA (19x19) -
10AS066H2F34E2SG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S050TS-1FCSG325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.