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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2F500M3G-CS288 | Microsemi | IC FPGA 500K GATES 512KB 288-CSP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F500M3G | 288-CSP (11x11) | - | |
| 5ASXBB5D6F40C6N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXBB5 | 1517-FBGA (40x40) | - | |
| XC7Z045-3FFG900E | Xilinx | IC SOC CORTEX-A9 KINTEX7 900FBGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | XC7Z045 | 900-FCBGA (31x31) | - | |
| BCM7405ZKFEB13G | Avago Technologies (Broadcom Limited) | SOC DIGITAL GATEWAY | BCM7405 | - | - | - | - | - | - | - | - | |
| XCZU6EG-L2FFVC900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| 10AS022E3F29I1HG | Intel® FPGAs | IC SOC FPGA 288 I/O 780FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - | |
| XCZU4EG-2FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| M2S090TS-FG676I | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - | |
| M2S005S-FGG484 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S025TS-1VFG400I | Microsemi | IC FPGA SOC 25K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | M2S025TS | 400-VFBGA (17x17) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.