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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XAZU2EG-1SFVA625Q Xilinx XAZU2EG-1SFVA625Q - - - Tray - - - - -
M2S150TS-FCVG484I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BFBGA - 484-BGA -
5CSEBA5U23I7LN Intel® FPGAs 672-PIN UBGA - - - Tray - - - - -
M2S025T-1FGG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S025T 484-FPBGA (23x23) -
5ASXMB3E4F31C6N Altera (Intel® Programmable Solutions Group) IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 896-BBGA, FCBGA 5ASXMB3 896-FBGA (31x31) -
XCZU3EG-L1SBVA484I Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
XCZU17EG-1FFVC1760I Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
XCZU7EV-3FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU3CG-1SFVC784I Xilinx XCZU3CG-1SFVC784I Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
M2S025T-1FGG484 Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S025T 484-FPBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.