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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S005-TQG144 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - | |
| 5CSEMA5F31I7N | Altera (Intel® Programmable Solutions Group) | IC FPGA 288 I/O 896FBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BGA | 5CSEMA5 | 896-FBGA (31x31) | - | |
| XCZU2CG-2SBVA484I | Xilinx | IC FPGA 82 I/O 484FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | - | 484-FCBGA (19x19) | - | |
| 10AS032H2F34I2SG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 5CSEMA6U23C6N | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSEMA6 | 672-UBGA (23x23) | - | |
| 10AS032E2F27I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| 10AS066K1F40E1HG | Intel® FPGAs | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - | |
| XCZU5EV-1FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EV | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| XCZU2EG-1SBVA484E | Xilinx | IC FPGA 82 I/O 484FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | - | 484-FCBGA (19x19) | - | |
| M2S060-1FGG484I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.