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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S005-TQG144 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
5CSEMA5F31I7N Altera (Intel® Programmable Solutions Group) IC FPGA 288 I/O 896FBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 896-BGA 5CSEMA5 896-FBGA (31x31) -
XCZU2CG-2SBVA484I Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
10AS032H2F34I2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
5CSEMA6U23C6N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEMA6 672-UBGA (23x23) -
10AS032E2F27I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 240 I/O 672FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
10AS066K1F40E1HG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
XCZU5EV-1FBVB900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU2EG-1SBVA484E Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
M2S060-1FGG484I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.