Invent, Innovate, Integrate
- info@zenkaeurope.com
-
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
- Products
- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
Manufacturer
Series
Operating Temperature
Packaging
Package / Case
Base Part Number
Supplier Device Package
Clear Filters
Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S050T-VF400I | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - |
|
XCZU17EG-1FFVE1924I | Xilinx | IC FPGA 668 I/O 1924FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1924-BBGA, FCBGA | - | 1924-FCBGA (45x45) | - |
|
|
M2S025TS-1FCSG325I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - |
|
|
M2S090TS-1FGG676I | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | M2S090TS | 676-FBGA (27x27) | - |
|
|
M2S005S-1VF256I | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 256-VFBGA | - | 256-BGA (17x17) | - |
|
|
XC7Z045-1FFG900I | Xilinx | IC SOC CORTEX-A9 KINTEX7 900FBGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | XC7Z045 | 900-FCBGA (31x31) | - |
|
M2S050-FG896 | Microsemi | IC FPGA SOC 50K LUTS 896FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 896-FBGA | M2S050 | 896-FBGA (31x31) | - |
|
|
M2S050TS-FG896 | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BGA | - | 896-FBGA (31x31) | - |
|
|
A2F500M3G-CS288I | Microsemi | IC FPGA 500K GATES 512KB 288-CSP | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F500M3G | 288-CSP (11x11) | - |
|
|
XCZU3CG-L2SFVA625E | Xilinx | IC FPGA 180 I/O 625FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 625-BFBGA, FCBGA | - | 625-FCBGA (21x21) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.