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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10AS032E2F29I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 360 I/O 780FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - | |
| 5ASXFB5H4F40C6NES | Altera (Intel® Programmable Solutions Group) | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXFB5 | 1517-FBGA (40x40) | - | |
| M2S005-1VFG256 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | - | 256-FPBGA (17x17) | - | |
| 1SX280LN2F43I2VG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| M2S050T-1VF400 | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | M2S050T | 400-VFBGA (17x17) | - | |
| XCZU2EG-2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| 10AS048H4F34I3SG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| XC7Z100-L2FFG900I | Xilinx | IC SOC CORTEX-A9 KINTEX7 900BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| 5CSEBA5U23I7N | Altera (Intel® Programmable Solutions Group) | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | - | Tray | - | 672-FBGA | 5CSEBA5 | 672-UBGA (23x23) | - | |
| 10AS016E4F27E3LG | Intel® FPGAs | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.