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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S090T-1FG484M Microsemi IC FPGA SOC 90K LUTS 484FBGA SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
10AS048E2F29I1HG Intel® FPGAs IC SOC FPGA 360 I/O 780FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
M2S025-1VFG400 Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S025 400-VFBGA (17x17) -
BCM3384GUIFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
M2S060T-1FCS325I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
XC7Z020-2CLG400E Xilinx IC SOC CORTEX-A9 ARTIX-7 400BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 400-LFBGA, CSPBGA XC7Z020 400-CSPBGA (17x17) -
M2S060TS-1VF400I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
10AS066H3F34E2SG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
XCZU15EG-2FFVB1156I Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XC7Z045-2FBG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.