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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEBA5U23C7N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEBA5 672-UBGA (23x23) -
10AS022E3F27I2SG Intel® FPGAs 672-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
M2S150TS-1FCSG536 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 536-LFBGA - 536-BGA (16x16) -
M2S010TS-VF400 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
10AS066N2F40I1SP Altera (Intel® Programmable Solutions Group) IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
10AS016E3F29E1HG Intel® FPGAs IC SOC FPGA 288 I/O 780FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
XCZU2EG-2SFVA625E Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
XCZU3CG-L2SBVA484E Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
XCZU2CG-1SFVA625E Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
A2F500M3G-1FGG484I Microsemi IC FPGA 500K GATES 512KB 484-BGA SmartFusion® -40°C ~ 100°C (TJ) - Tray - 484-BGA A2F500M3G 484-FPBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.