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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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10AS066N1F40I1HG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - |
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10AS027E3F29I2SG | Intel® FPGAs | 780-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
XCZU9EG-1FFVB1156I | Xilinx | IC FPGA 328 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - |
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XC7Z035-3FBG676E | Xilinx | IC SOC CORTEX-A9 KINTEX7 676BGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | - | 676-FCBGA (27x27) | - |
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XC7Z030-1FFG676C | Xilinx | IC SOC CORTEX-A9 KINTEX7 676FBGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | XC7Z030 | 676-FCBGA (27x27) | - |
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XCZU7CG-1FFVC1156E | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - |
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10AS032E1F27I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - |
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XCZU9EG-L1FFVC900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - |
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A2F200M3F-PQ208 | Microsemi | IC FPGA 200K GATES 256KB 208QFP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 208-BFQFP | A2F200 | 208-PQFP (28x28) | - |
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A2F500M3G-PQG208 | Microsemi | IC FPGA 500K GATES 512KB 208QFP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 208-BFQFP | A2F500M3G | 208-PQFP (28x28) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.