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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS032H1F34I1HG Intel® FPGAs IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
5CSXFC6D6F31A7N Intel® FPGAs IC FPGA 288 I/O 896FBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) - Tray - 896-BGA - 896-FBGA (31x31) -
M2S090T-1FCS325I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S010-FGG484I Microsemi IC FPGA SOC 10K LUT 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
XC7Z035-2FBG676E Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
10AS048K2F35E2LG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S060TS-1VFG400 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
10AS016E4F27I3SG Intel® FPGAs IC SOC FPGA 240 I/O 672FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
10AS066H2F34E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
XCZU6EG-1FFVB1156E Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.