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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10AS032H1F34I1HG | Intel® FPGAs | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 5CSXFC6D6F31A7N | Intel® FPGAs | IC FPGA 288 I/O 896FBGA | Automotive, AEC-Q100, Cyclone® V SE | -40°C ~ 125°C (TJ) | - | Tray | - | 896-BGA | - | 896-FBGA (31x31) | - | |
| M2S090T-1FCS325I | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| M2S010-FGG484I | Microsemi | IC FPGA SOC 10K LUT 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| XC7Z035-2FBG676E | Xilinx | IC SOC CORTEX-A9 KINTEX7 676BGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | - | 676-FCBGA (27x27) | - | |
| 10AS048K2F35E2LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| M2S060TS-1VFG400 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| 10AS016E4F27I3SG | Intel® FPGAs | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| 10AS066H2F34E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | |
| XCZU6EG-1FFVB1156E | Xilinx | IC FPGA 328 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.