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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S025TS-FG484I Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
5ASXBB3D4F35C6N Altera (Intel® Programmable Solutions Group) IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXBB3 1152-FBGA (35x35) -
10AS027H1F34E1HG Intel® FPGAs IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU25DR-L2FFVG1517I Xilinx XCZU25DR-L2FFVG1517I - - - Tray - - - - -
XCZU3CG-2SBVA484I Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -
M2S005S-1VFG400 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
XC7Z045-2FF900I Xilinx XC7Z045-2FF900I Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S050TS-VF400I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
XCZU17EG-3FFVE1924E Xilinx IC FPGA 668 I/O 1924FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1924-BBGA, FCBGA - 1924-FCBGA (45x45) -
5CSEMA5U23C6N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEMA5 672-UBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.