Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCM3384GIFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - | |
| A2F500M3G-1FG484M | Microsemi | IC FPGA 500K GATES 512KB 484FBGA | SmartFusion® | -55°C ~ 125°C (TJ) | - | Tray | - | 484-BGA | A2F500M3G | 484-FPBGA (23x23) | - | |
| 10AS027H1F35I1HG | Intel® FPGAs | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 5CSXFC5C6U23C8N | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSXFC5 | 672-UBGA (23x23) | - | |
| 10AS027E2F27I1HG | Intel® FPGAs | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| M2S150-FC1152 | Microsemi | IC FPGA SOC 150K LUTS 1152FCBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | - | |
| XCZU7CG-2FFVF1517I | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| XCZU5CG-L2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| 10AS066N2F40I2LG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S050T-VF400I | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.