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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
BCM3384GIFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
A2F500M3G-1FG484M Microsemi IC FPGA 500K GATES 512KB 484FBGA SmartFusion® -55°C ~ 125°C (TJ) - Tray - 484-BGA A2F500M3G 484-FPBGA (23x23) -
10AS027H1F35I1HG Intel® FPGAs IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
5CSXFC5C6U23C8N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSXFC5 672-UBGA (23x23) -
10AS027E2F27I1HG Intel® FPGAs IC SOC FPGA 240 I/O 672FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 672-BBGA, FCBGA - 672-FBGA (27x27) -
M2S150-FC1152 Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S150 1152-FCBGA (35x35) -
XCZU7CG-2FFVF1517I Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU5CG-L2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
10AS066N2F40I2LG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S050T-VF400I Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.