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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU17EG-2FFVB1517E | Xilinx | IC FPGA 644 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| 10AS057N3F40E2LG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S010S-1VF400I | Microsemi | IC FPGA SOC 10K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | M2S010S | 400-VFBGA (17x17) | - | |
| A2F500M3G-FG484M | Microsemi | IC FPGA 500K GATES 512KB 484FBGA | SmartFusion® | -55°C ~ 125°C (TJ) | - | Tray | - | 484-BGA | A2F500M3G | 484-FPBGA (23x23) | - | |
| A2F060M3E-1CSG288 | Microsemi | IC FPGA 60K GATES 128KB 288-CSP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | - | |
| 10AS057N1F40E1HG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FBGA (40x40) | - | |
| M2S005-VFG256 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LFBGA | - | 256-VFPBGA (14x14) | - | |
| M2S050TS-1FGG484 | Microsemi | IC FPGA SOC 50K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| 10AS048H4F34I3LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 5CSEMA6U23A7N | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Automotive, AEC-Q100, Cyclone® V SE | -40°C ~ 125°C (TJ) | - | Tray | - | 672-FBGA | 5CSEMA6 | 672-UBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.