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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S090T-FGG676 Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 676-BGA M2S090T 676-FBGA (27x27) -
XCZU2CG-1SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
1SX250LH3F55E3VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU4CG-L2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
5CSEMA6F31C6N Intel® FPGAs IC FPGA 288 I/O 896FBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSEMA6 896-FBGA (31x31) -
XCZU21DR-2FFVD1156E Xilinx XCZU21DR-2FFVD1156E - - - Tray - - - - -
M2S100-1FCG1152 Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100 1152-FCBGA (35x35) -
M2S050TS-FCS325 Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
A2F060M3E-1TQ144I Microsemi IC FPGA 60K GATES 128KB 144-TQFP SmartFusion® -40°C ~ 100°C (TJ) - Tray - 144-LQFP A2F060M3E 144-TQFP (20x20) -
XCZU4EV-3FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.