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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10AS066N4F40I3LG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S060T-VF400I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| A2F060M3E-1TQ144 | Microsemi | IC FPGA 60K GATES 128KB 144-TQFP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | - | |
| M2S090T-1FGG676I | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | M2S090T | 676-FBGA (27x27) | - | |
| 5CSEBA4U23I7SN | Intel® FPGAs | IC FPGA 188 I/O 672UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | - | Tray | - | 672-FBGA | - | 672-UBGA (23x23) | - | |
| 5CSEBA2U19I7SN | Altera (Intel® Programmable Solutions Group) | IC FPGA 240 I/O 484UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | - | Tray | - | 484-FBGA | 5CSEBA2 | 484-UBGA (19x19) | - | |
| M2S150T-FCG1152 | Microsemi | IC FPGA SOC 150K LUTS 1152FCBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S150T | 1152-FCBGA (35x35) | - | |
| 10AS022E3F27E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| XCZU4EV-1SFVC784I | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EV | -40°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| 5ASTFD3G3F35I5N | Intel® FPGAs | IC FPGA 350 I/O 1152FBGA | Arria V ST | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | 5ASTFD3 | 1152-FBGA (35x35) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.