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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z014S-2CLG400E | Xilinx | IC FPGA SOC 200I/O 400BGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA, CSPBGA | - | 400-CSPBGA (17x17) | - | |
| XC7Z030-2FBG484I | Xilinx | IC SOC CORTEX-A9 KINTEX7 484FBGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | XC7Z030 | 484-FCBGA (23x23) | - | |
| 10AS066K4F35E3SG | Intel® FPGAs | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 10AS027H2F34I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| XCZU7CG-L1FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| 10AS057N2F40I2SG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| XCZU5EG-1SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| XCZU17EG-2FFVC1760E | Xilinx | IC FPGA 512 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - | |
| M2S090T-FGG676 | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | M2S090T | 676-FBGA (27x27) | - | |
| XCZU2CG-1SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.