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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S100TS-1FCG1152I Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100TS 1152-FCBGA (35x35) -
10AS027H2F34E2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU3CG-2SFVA625E Xilinx XCZU3CG-2SFVA625E Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
XC7Z035-1FBG676C Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
10AS066N4F40I3LG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S060T-VF400I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
A2F060M3E-1TQ144 Microsemi IC FPGA 60K GATES 128KB 144-TQFP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 144-LQFP A2F060M3E 144-TQFP (20x20) -
M2S090T-1FGG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA M2S090T 676-FBGA (27x27) -
5CSEBA4U23I7SN Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
5CSEBA2U19I7SN Altera (Intel® Programmable Solutions Group) IC FPGA 240 I/O 484UBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 484-FBGA 5CSEBA2 484-UBGA (19x19) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.