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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5ASXBB5D4F31I5N | Intel® FPGAs | IC FPGA 170 I/O 896FBGA | Arria V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BBGA, FCBGA | 5ASXBB5 | 896-FBGA (31x31) | - | |
| M2S010-1VFG256 | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | - | 256-FPBGA (17x17) | - | |
| M2S010TS-FGG484I | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| A2F200M3F-1PQG208I | Microsemi | IC FPGA 200K GATES 256KB 208QFP | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 208-BFQFP | A2F200 | 208-PQFP (28x28) | - | |
| 1SX250LN2F43I2LG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| A2F500M3G-FGG484M | Microsemi | IC FPGA 500K GATES 512KB 484FBGA | SmartFusion® | -55°C ~ 125°C (TJ) | - | Tray | - | 484-BGA | A2F500M3G | 484-FPBGA (23x23) | - | |
| 10AS048H2F34I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 10AS057H1F34I1HG | Intel® FPGAs | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| XCZU7EG-3FFVF1517E | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| XCZU17EG-L1FFVB1517I | Xilinx | IC FPGA 644 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.