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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S050S-1VF400I Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S050S 400-VFBGA (17x17) -
5CSEBA6U19A7N Intel® FPGAs IC FPGA 66 I/O 484UBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) - Tray - 484-FBGA 5CSEBA6 484-UBGA (19x19) -
A2F500M3G-FG256 Microsemi IC FPGA 500K GATES 512KB 256-BGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FPBGA (17x17) -
XCZU6EG-3FFVB1156E Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
5CSXFC2C6U23C6N Altera (Intel® Programmable Solutions Group) IC FPGA 224 I/O 672UBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSXFC2 672-UBGA (23x23) -
5CSEBA6U19I7NTS Intel® FPGAs 484-PIN UBGA - - - Tray - - - - -
XCZU15EG-1FFVB1156E Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
M2S150TS-FCG1152I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
10AS057K2F40E2LG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S010TS-1VFG256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.