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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S150-1FCVG484 | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BFBGA | - | 484-BGA | - | |
| 5CSEMA6F31C7N | Intel® FPGAs | IC FPGA 288 I/O 896FBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BGA | 5CSEMA6 | 896-FBGA (31x31) | - | |
| 1SX280LU3F50E2VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 10AS057N3F40E2SG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S005S-1FGG484 | Microsemi | IC FPGA SOC 5K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S050TS-FCSG325I | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| A2F060M3E-CS288 | Microsemi | IC FPGA 60K GATES 128KB 288-CSP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | - | |
| M2S060T-1VF400 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| BCM33843DUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - | |
| M2S090S-1FGG676I | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | M2S090S | 676-FBGA (27x27) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.