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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEMA4U23A7N Intel® FPGAs IC FPGA 188 I/O 672UBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
5CSEMA2U23C8N Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
M2S060T-1FG484I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S025-1VFG400I Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S025 400-VFBGA (17x17) -
5CSEBA5U23A7N Intel® FPGAs IC FPGA 145 I/O 672UBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) - Tray - 672-FBGA 5CSEBA5 672-UBGA (23x23) -
M2S100S-1FCG1152I Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100S 1152-FCBGA (35x35) -
M2S025TS-1FCS325I Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
A2F060M3E-FGG256 Microsemi IC FPGA 60K GATES 128KB 256FBGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 256-LBGA A2F060M3E 256-FBGA (17x17) -
BCM3384DKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
5CSEMA5U23I7N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE -40°C ~ 100°C (TJ) - Tray - 672-FBGA 5CSEMA5 672-UBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.