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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5CSXFC5D6F31C8N | Altera (Intel® Programmable Solutions Group) | IC FPGA 288 I/O 896FBGA | Cyclone® V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BGA | 5CSXFC5 | 896-FBGA (31x31) | - | |
| 10AS066H1F34I1HG | Intel® FPGAs | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 1SX250LH3F55E1VG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| A2F060M3E-1FG256 | Microsemi | IC FPGA 60K GATES 128KB 256FBGA | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | - | |
| 10AS016E3F27E1HG | Intel® FPGAs | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| 10AS057K4F40E3SG | Intel® FPGAs | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| XCZU19EG-2FFVD1760I | Xilinx | IC FPGA 308 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - | |
| M2S060T-FCSG325I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| M2S090TS-FGG676I | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - | |
| M2S100-FC1152 | Microsemi | IC FPGA SOC 100K LUTS 1152FCBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S100 | 1152-FCBGA (35x35) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.