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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S005-1VFG400 Microsemi IC FPGA SOC 5K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S005 400-VFBGA (17x17) -
5CSEMA5U23C8N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEMA5 672-UBGA (23x23) -
XCZU19EG-3FFVD1760E Xilinx IC FPGA 308 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
XCZU9CG-2FFVB1156E Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
A2F060M3E-1FGG256M Microsemi IC FPGA 60K GATES 128KB 256FBGA SmartFusion® -55°C ~ 125°C (TJ) - Tray - 256-LBGA A2F060M3E 256-FBGA (17x17) -
XCZU25DR-1FFVE1156I Xilinx XCZU25DR-1FFVE1156I - - - Tray - - - - -
M2S050T-FCSG325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
5CSEBA4U19C8N Intel® FPGAs IC FPGA 161 I/O 484FBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 484-FBGA - 484-UBGA (19x19) -
M2S005-FGG484I Microsemi IC FPGA SOC 5K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
5CSEMA4U23A7N Intel® FPGAs IC FPGA 188 I/O 672UBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.