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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU9EG-L1FFVB1156I Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XCZU5CG-2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
5CSXFC6C6U23C8N Altera (Intel® Programmable Solutions Group) IC FPGA 145 I/O 672UBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSXFC6 672-UBGA (23x23) -
0W635-006-XTP AMI Semiconductor / ON Semiconductor IC DSP EZAIRO 5920 SMD - - - Tape & Reel (TR) - - - - -
A2F500M3G-FG256M Microsemi IC FPGA 500K GATES 512KB 256FBGA SmartFusion® -55°C ~ 125°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FPBGA (17x17) -
1SX280LN2F43E2VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS048E3F29I2LG Intel® FPGAs 780-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
M2S010-1TQ144I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
XC7Z100-1FFG900I Xilinx IC SOC CORTEX-A9 KINTEX7 900FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA XC7Z100 900-FCBGA (31x31) -
1SX250LU3F50E2LG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.