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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S090S-1FGG676I | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | M2S090S | 676-FBGA (27x27) | - | |
| 10AS066K3F35E2SG | Intel® FPGAs | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| M2S060TS-FGG676I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - | |
| 10AS027H1F34I1HG | Intel® FPGAs | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| XCZU15EG-L2FFVB1156E | Xilinx | IC FPGA 328 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| XA7Z030-1FBG484Q | Xilinx | VIRTEX-7 FBGA BLOCK FBGA484 | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 125°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | - | 484-FCBGA (23x23) | - | |
| M2S025TS-1VFG256 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | - | 256-FPBGA (17x17) | - | |
| M2S100S-1FC1152I | Microsemi | IC FPGA SOC 100K LUTS 1152FCBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S100S | 1152-FCBGA (35x35) | - | |
| M2S050-FGG896I | Microsemi | IC FPGA SOC 896-FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BGA | - | 896-FBGA (31x31) | - | |
| A2F500M3G-1PQG208I | Microsemi | IC FPGA 500K GATES 512KB 208QFP | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 208-BFQFP | A2F500M3G | 208-PQFP (28x28) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.