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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S090S-1FGG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA M2S090S 676-FBGA (27x27) -
10AS066K3F35E2SG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S060TS-FGG676I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
10AS027H1F34I1HG Intel® FPGAs IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU15EG-L2FFVB1156E Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XA7Z030-1FBG484Q Xilinx VIRTEX-7 FBGA BLOCK FBGA484 Automotive, AEC-Q100, Zynq®-7000 XA -40°C ~ 125°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (23x23) -
M2S025TS-1VFG256 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
M2S100S-1FC1152I Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100S 1152-FCBGA (35x35) -
M2S050-FGG896I Microsemi IC FPGA SOC 896-FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 896-BGA - 896-FBGA (31x31) -
A2F500M3G-1PQG208I Microsemi IC FPGA 500K GATES 512KB 208QFP SmartFusion® -40°C ~ 100°C (TJ) - Tray - 208-BFQFP A2F500M3G 208-PQFP (28x28) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.