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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XC7Z030-1FBG484I Xilinx IC SOC CORTEX-A9 KINTEX7 484FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA XC7Z030 484-FCBGA (23x23) -
M2S090-1FCSG325 Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S005S-1TQG144 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
10AS022C3U19E2LG Intel® FPGAs 484-PIN UBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S005-1VF400I Microsemi IC FPGA SOC 5K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S005 400-VFBGA (17x17) -
5CSEBA6U23A7N Intel® FPGAs IC FPGA 145 I/O 672UBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) - Tray - 672-FBGA 5CSEBA6 672-UBGA (23x23) -
M2S090-FCSG325 Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
A2F200M3F-1PQG208 Microsemi IC FPGA 256K FLASH 208QFP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 208-BFQFP A2F200 208-PQFP (28x28) -
M2S150-FCV484 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BFBGA - 484-BGA -
A2F500M3G-FGG256I Microsemi IC FPGA 500K GATES 512KB 256-BGA SmartFusion® -40°C ~ 100°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.