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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S010-1TQG144 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
10AS057H2F34I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S150-1FC1152I Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA M2S150 1152-FCBGA (35x35) -
M2S150-1FCVG484 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BFBGA - 484-BGA -
5CSEMA6F31C7N Intel® FPGAs IC FPGA 288 I/O 896FBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSEMA6 896-FBGA (31x31) -
1SX280LU3F50E2VG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS057N3F40E2SG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S005S-1FGG484 Microsemi IC FPGA SOC 5K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S050TS-FCSG325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
A2F060M3E-CS288 Microsemi IC FPGA 60K GATES 128KB 288-CSP SmartFusion® 0°C ~ 85°C (TJ) - Tray - 288-TFBGA, CSPBGA A2F060M3E 288-CSP (11x11) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.