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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS066K2F40I2LG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
M2S090TS-1FCS325I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
5ASXFB3H4F40I5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXFB3 1517-FBGA (40x40) -
M2S060TS-FCS325 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
A2F500M3G-1PQ208I Microsemi IC FPGA 500K GATES 512KB 208QFP SmartFusion® -40°C ~ 100°C (TJ) - Tray - 208-BFQFP A2F500M3G 208-PQFP (28x28) -
XC7Z045-2FBG676CES Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -
M2S150-1FC1152 Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S150 1152-FCBGA (35x35) -
M2S010TS-1FGG484M Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S100T-FCG1152 Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100T 1152-FCBGA (35x35) -
10AS032E2F27I2LG Intel® FPGAs 672-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.