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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S010TS-VFG256I | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 256-LBGA | - | 256-FPBGA (17x17) | - | |
| XCZU6CG-2FFVB1156I | Xilinx | XCZU6CG-2FFVB1156I | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| XCZU5CG-L2FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| M2S060-1FGG484 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S090-FGG676 | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | M2S090 | 676-FBGA (27x27) | - | |
| M2S010T-VF400I | Microsemi | IC FPGA SOC 10K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| 10AS016E3F29I2LG | Intel® FPGAs | IC SOC FPGA 288 I/O 780FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - | |
| A2F200M3F-1FGG256I | Microsemi | IC FPGA 200K GATES 256KB 256-BGA | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 256-LBGA | A2F200 | 256-FBGA (17x17) | - | |
| 10AS027E2F27I1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 240 I/O 672FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 672-BBGA, FCBGA | - | 672-FBGA (27x27) | - | |
| XCZU4EV-2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EV | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.