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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU11EG-2FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
M2S025T-1VF256 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
5CSEBA4U23C7N Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
M2S150-1FCS536I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 536-LFBGA - 536-BGA (16x16) -
A2F500M3G-1FG484I Microsemi IC FPGA 500K GATES 512KB 484-BGA SmartFusion® -40°C ~ 100°C (TJ) - Tray - 484-BGA A2F500M3G 484-FPBGA (23x23) -
M2S090TS-FG484I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
10AS048K3F35I2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
5CSEBA5U23C7SN Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEBA5 672-UBGA (23x23) -
XCZU7EV-2FFVF1517I Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU19EG-1FFVB1517I Xilinx IC FPGA 644 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.