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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S010TS-1FG484 | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - |
|
10AS016E3F29E2LG | Intel® FPGAs | IC SOC FPGA 288 I/O 780FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - |
|
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1SX250LH3F55E2LG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
XA7Z010-1CLG225Q | Xilinx | IC SOC CORTEX A-9 ZYNQ7 225BGA | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 125°C (TJ) | - | Tray | - | 225-LFBGA, CSPBGA | - | 225-CSPBGA (13x13) | - |
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10AS032H1F35I1HG | Intel® FPGAs | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - |
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10AS032E4F27E3LG | Intel® FPGAs | 672-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
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M2S150-FCSG536 | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 536-LFBGA | - | 536-BGA (16x16) | - |
|
M2S050-1FGG896I | Microsemi | IC FPGA SOC 50K LUTS 896FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 896-FBGA | M2S050 | 896-FBGA (31x31) | - |
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M2S060TS-1FG484 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - |
|
5CSEBA6U23C8SN | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSEBA6 | 672-UBGA (23x23) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.