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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU9EG-1FFVC900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - |
|
1SX250LH3F55I2LG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
|
XAZU3EG-1SFVA625I | Xilinx | XAZU3EG-1SFVA625I | - | - | - | Tray | - | 625-BFBGA, FCBGA | - | 625-FCBGA (21x21) | - |
|
M2S090TS-1FG676 | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - |
|
5ASXBB3D4F35C5N | Intel® FPGAs | IC FPGA 350 I/O 1152FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | 5ASXBB3 | 1152-FBGA (35x35) | - |
|
A2F500M3G-PQ208I | Microsemi | IC FPGA 500K GATES 512KB 208QFP | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 208-BFQFP | A2F500M3G | 208-PQFP (28x28) | - |
|
5CSXFC4C6U23A7N | Intel® FPGAs | IC FPGA 188 I/O 672UBGA | Automotive, AEC-Q100, Cyclone® V SE | -40°C ~ 125°C (TJ) | - | Tray | - | 672-FBGA | - | 672-UBGA (23x23) | - |
|
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1SX280LU3F50E2VGS1 | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
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M2S025TS-1FCSG325 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - |
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M2S090-FG484 | Microsemi | IC FPGA SOC 90K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S090 | 484-FPBGA (23x23) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.