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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S025TS-1FCSG325 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| M2S090-FG484 | Microsemi | IC FPGA SOC 90K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S090 | 484-FPBGA (23x23) | - | |
| M2S005S-VFG400 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| XCZU4CG-L1FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| XCZU4EG-2SFVC784I | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| 10AS027H4F35I3SG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 1SX280LH2F55I2VG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 10AS032H3F35I2LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 10AS032H4F34E3LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| XC7Z020-1CLG400I | Xilinx | IC SOC CORTEX-A9 ARTIX-7 400BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA, CSPBGA | XC7Z020 | 400-CSPBGA (17x17) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.