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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS057K4F35E3SG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S010S-1TQ144 Microsemi IC FPGA SOC SmartFusion®2 0°C ~ 85°C (TJ) - Tray - - - - -
XCZU7EV-2FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
5CSXFC6D6F31I7N Altera (Intel® Programmable Solutions Group) IC FPGA 288 I/O 896FBGA Cyclone® V SX -40°C ~ 100°C (TJ) - Tray - 896-BGA 5CSXFC6 896-FBGA (31x31) -
A2F200M3F-FGG256I Microsemi IC FPGA 200K GATES 256KB 256-BGA SmartFusion® -40°C ~ 100°C (TJ) - Tray - 256-LBGA A2F200 256-FBGA (17x17) -
M2S005S-1VF400I Microsemi IC FPGA SOC 5K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S005S 400-VFBGA (17x17) -
M2S010T-1FGG484 Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S010T 484-FPBGA (23x23) -
1SX250LN2F43I1VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
10AS022E4F27E3SG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU3CG-1SBVA484I Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (19x19) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.