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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5ASXBB5D4F35C4N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXBB5 1152-FBGA (35x35) -
XCZU7EV-L1FFVF1517I Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU2EG-1SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
XCZU6EG-1FFVB1156I Xilinx IC FPGA 328 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XC7Z030-L2FBG484I Xilinx IC SOC CORTEX-A9 KINTEX7 484BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (23x23) -
10AS032H2F35I2LG Intel® FPGAs 1152-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XCZU4CG-2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
M2S090TS-1FGG676T2 Microsemi IC FPGA SOC Automotive, AEC-Q100, SmartFusion®2 -40°C ~ 125°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
XC7Z045-2FF676I Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
M2S060-VFG400I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.