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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XC7Z045-2FF676I | Xilinx | IC SOC CORTEX-A9 KINTEX7 676BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | - | 676-FCBGA (27x27) | - |
|
M2S060-VFG400I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - |
|
1SX280LH3F55E2LG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
5ASXBB5D4F40C6N | Altera (Intel® Programmable Solutions Group) | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXBB5 | 1517-FBGA (40x40) | - |
|
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A2F500M3G-FGG256 | Microsemi | IC FPGA 512K FLASH 256FBGA | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | A2F500M3G | 256-FBGA (17x17) | - |
|
10AS066K3F35I2LG | Intel® FPGAs | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - |
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10AS048H2F34I2LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
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M2S025T-1VF400 | Microsemi | IC FPGA SOC 25K LUTS 400VFBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | M2S025T | 400-VFBGA (17x17) | - |
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10AS066H4F34E3LG | Intel® FPGAs | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - |
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M2S025T-FCS325 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.