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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS066H2F34I1HG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S025T-VFG256 Microsemi IC FPGA SOC 25K LUTS 256VFG SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
XCZU2EG-L2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
XC7Z020-2CLG484I Xilinx IC SOC CORTEX-A9 ARTIX-7 484BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA XC7Z020 484-CSPBGA (19x19) -
M2S090-1FCS325 Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
10AS066K3F40E2SG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
M2S060TS-FGG484 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
XCZU5EV-L2FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
5CSEBA2U23C7SN Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
XC7Z015-1CLG485I Xilinx IC SOC CORTEX-A9 ARTIX-7 485BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 485-CSBGA (19x19) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.