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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S010T-1FGG484I | Microsemi | IC FPGA SOC 10K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | M2S010T | 484-FPBGA (23x23) | - | |
| 10AS066H2F34I2SG | Intel® FPGAs | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | |
| XCZU5EV-2SFVC784I | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EV | -40°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - | |
| 10AS027H2F35E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| M2S060TS-FG484 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| XCZU6CG-L2FFVB1156E | Xilinx | IC FPGA 328 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| M2S060-1FG484 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S150-1FCV484I | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BFBGA | - | 484-BGA | - | |
| XA7Z010-1CLG400Q | Xilinx | IC SOC CORTEX A-9 ZYNQ7 400BGA | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 125°C (TJ) | - | Tray | - | 400-LFBGA, CSPBGA | - | 400-CSPBGA (17x17) | - | |
| 5CSTFD6D5F31I7N | Altera (Intel® Programmable Solutions Group) | IC FPGA 288 I/O 896FBGA | Cyclone® V ST | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BGA | 5CSTFD6 | 896-FBGA (31x31) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.