• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai

Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
Manufacturer
Series
Operating Temperature
Packaging
Package / Case
Base Part Number
Supplier Device Package

Clear Filters

Loading products…

Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS057K2F35I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
XC7Z010-1CLG400I Xilinx IC SOC CORTEX-A9 ARTIX-7 400BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA, CSPBGA XC7Z010 400-CSPBGA (17x17) -
A2F060M3E-1TQG144I Microsemi IC FPGA 60K GATES 128KB 144-TQFP SmartFusion® -40°C ~ 100°C (TJ) - Tray - 144-LQFP A2F060M3E 144-TQFP (20x20) -
XCZU9CG-1FFVC900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU7EV-1FFVF1517I Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
M2S010T-1FG484I Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S010T 484-FPBGA (23x23) -
10AS022E3F27E2LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS027H3F34E2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S025T-VF400I Microsemi IC FPGA SOC 25K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
M2S060-1FG676 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.